The ICES 673 is a COM Express Type 6 compact size module which features Intel® Core™ MCP processor (codename Skylake) and supports dual DDR4 SO-DIMM memory sockets with Non-ECC support, up to 32GB 2133MHz. It is integrated with Intel® integration graphics for powerful graphics processing and through interfaces like eDP and 2 x DDI. This new ICES 673 supports triple displays, on board eMMC up to 16G, and advanced I/O interfaces such as 5 x PCI Express gen. 3, 3 x SATA3.0, and 8 x USB 2.0.