ICES 673

COMe Type 6, Compact Size Module with 6th Gen. Intel® Core™ processor MCP solution, DDR4/ 5 x PCIe x 1/4 x USB3.0 / 3 x SATA3.0 and GbE

Main Feature
On-Board Intel® Core™ processor
2 channel DDR4 without ECC/SO-DIMMs 2133MHz up to 32GB
Support three independent displays with eDP and 2 x DDI (Support HDMI/DP/DVI)
Support eMMC 5.0 up to 16G
5 x PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 3 x SATA 3.0 and GbE
Support Windows 10

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Datasheet(PDF)

The ICES 673 is a COM Express Type 6 compact size module which features Intel® Core™ MCP processor (codename Skylake) and supports dual DDR4 SO-DIMM memory sockets with Non-ECC support, up to 32GB 2133MHz. It is integrated with Intel® integration graphics for powerful graphics processing and through interfaces like eDP and 2 x DDI. This new ICES 673 supports triple displays, on board eMMC up to 16G, and advanced I/O interfaces such as 5 x PCI Express gen. 3, 3 x SATA3.0, and 8 x USB 2.0.

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