NEXCOM has expanded its outstanding PICMG PEAK series with PICMG 1.0 full-size SBC PEAK 779VL2 to help client expand the life cycle of existing applications. Based on the 3rd generation Intel® Core™ processor, the PEAK 779VL2 is the successor to NEXCOM PICMG 1.0 SBCs—PEAK 715 and PEAK 777. By strengthening NEXCOM's continue support for the PICMG 1.0 specification, the PEAK 779 allows users to confidently proceed with development of including PC-based machinery, AIO, telecommunication, medical controller, and surveillance applications based on NEXCOM PEAK series.
To accompany the PICMG 1.0 SBC PEAK 779, NEXCOM PEAK series is also available with the PICMG 1.0 passive backplane NBP0807P, NBP1407P, NBP1412P, and NBP2027P. The four backplanes carry different number of PCI and ISA slots and are suited for 2U, 4U and 6U rackmount systems.
PICMG 1.0 full-Size SBC, 3rd generation Intel® Core™ i7/i5/i3 processor paired with Intel® B75 chipset, up to 16GB of DDR3 DIMM 1333/1600MHz, VGA integrated, 2x GbE, 4 x SATA
8-slot PICMG 1.0 backplane, 2x PICMG, 7x PCI, 1x Pericom P17C8150MA bridge 21150
14-slot PICMG 1.0 backplane, 2x PICMG, 7x PCI, 5x ISA, 1x Pericom P17C8150MA bridge 21152
14-slot PICMG 1.0 backplane, 2x PICMG, 12x PCI, 2x Pericom P17C8150MA bridge controller, power input: P8/P9, ATX, terminal block
20-slot 2-segment PICMG 1.0 backplane, 2x PICMG, 14x PCI, independent power on/off, 2x Pericom P17C8150MA Bridge