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December 11, 2012

COM Express ICES 667 Powered by 3rd Generation Intel® Core™ Processor Family

NEXCOM COM Express Type 6 Basic module ICES 667 features the 3rd generation Intel® Core™ processor family paired with mobile Intel® QM77 Express Chipset. It supports socket-type processors ranging from dual-core Celeron® Processor B810 to quad-core i7-3610QE processor and up to 16GB DDR3 1333/1600MHz SDRAM.


With the integrated Intel® HD Graphics 4000 and DirectX 11 support, the COM Express ICES 667 can simultaneously drive three independent displays. It also integrates USB 3.0, SATA 3.0 and PCIe 3.0 interfaces, all living up to the latest industrial standards to allow for high speed communication with peripherals and storage units.

COM Express ICES 667 Powered by 3rd Generation Intel® Core™ Processor Family

To enhance remote manageability, ICES 667 supports Intel® Active Management Technology 8.0 (AMT 8.0) and provides RAID 0/1/5/10 function to improve data access and protection.


To facilitate rapid deployment of individual projects, NEXCOM offers ICEK 667-T6 Starter Kit to help clients immediately assess ICES 667 and the full set of I/O functions it supports. With the Starter Kit, users can quickly come up with design modifications, effectively shortening product development process to enable smooth project implementation.

Main Features

  • PICMG COM.0 Rev. 2.0 Type 6, Basic module (95mm x 125mm)
  • rPGA 988 socket for the 3rd generation Intel® Core™ processors
  • Mobile Intel® QM77 Express Chipset (Optional HM76)
  • Dual DDR3 1333/1600MHz SO-DIMM sockets for up to 16GB
  • 3x independent displays: DisplayPort, HDMI, DVI, VGA, dual channel 18/24-bit LVDS
  • 1x PCIex16, 7x PCIex1, 4x USB 3.0, 8x USB 2.0, 2x SATA 3.0, 2x SATA 2.0 and GbE

Ordering Information

ICES 667 (P/N: 10K00066700X0)

COM Express Type 6, Basic module QM77, support 3rd Generation Intel® Core™ rPGA988 embedded processors, non-ECC DDR3/ 2x SO-DIMMs

ICEB 8060 (P/N: 10KB086000X0)

COM Express Type 6, COM.0 Rev. 2.0 evaluation carrier board, 3DDI/ VGA/ LVDS/ 4USB3.0/ 8USB2.0/ 6COM/ 2GbE/ 5.1HD, SPDIF/ 2SATA3.0/ mSATA/ CFast/ PCIex16/ PCIex4/ 2PCIex1/ mPCIe, ATX power input

ICEK 667-T6 (COM Express modules are subject to request)

COM Express Type 6 modules ICES 667 based on the 3rd Generation Intel® Core™ processors paired with mobile Intel® QM77 express chipset, reference carrier board ICEB 8060, built-in 4GB system memory, pre-installed trial version of Microsoft Windows® 7, bootable mini-SATA or CFast-SSD, 10.4" LCD panel and Flex ATX PSU AC 110/220V input


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