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May 09, 2025

NEXCOM Drives Edge AI, Dual 5G, and OT Security Innovation at CommunicAsia 2025

At CommunicAsia 2025 in Singapore, May 27–29, NEXCOM, a leading global supplier of network appliances, will showcase its latest portfolio of compact, rugged, and AI-powered network solutions designed to meet the growing demands of OT security, edge AI, and dual 5G failover connectivity. Visit NEXCOM at Hall 3, booth 3F3-13 to discover secure edge networking innovations purpose-built for the future.

 

NEXCOM Drives Edge AI, Dual 5G, and OT Security Innovation at CommunicAsia 2025

 

A spotlight of the exhibit is NEXCOM’s dual 5G failover solutions, available in two form factors:

  • DNA 140 - a desktop AI-enhanced platform for intelligent analytics and resilient 5G connectivity in branches.
  • ISA 141 - a rugged DIN rail box built for wide-temperature industrial environments, ensuring continuous uptime.

 

Both offer hybrid multi-carrier connectivity, seamlessly switching between public and private 5G for fail-safe communications in critical infrastructure.

 

NEXCOM NCS Products

 

NEXCOM will also showcase its complete OT security lineup, with each product mission-built for specific roles in ICS protection. For data-heavy edge sites, NEXCOM delivers compact AI-ready rackmounts, ideal for SD-WAN, SASE, and next-gen firewall applications. Completing the lineup is a suite of 5G and FWA uCPEs, headed by DFA 1163 supporting mmWave (FR2) for ultra-fast, low-latency wireless connectivity.

 

From enabling ultra-low-latency to safeguarding OT environments and accelerating edge AI, NEXCOM’s solutions are built to integrate seamlessly with third-party software, accelerating deployment and reducing total cost of ownership.

Why visit NEXCOM at CommunicAsia 2025?

  • Learn how to scale your infrastructure with performance, efficiency, and security
  • Get hands-on with dual 5G failover devices for hybrid connectivity
  • Explore a complete OT security lineup across mission-oriented rugged DIN rails
  • Meet NEXCOM experts to discuss integration opportunities and tailored deployments

Event Details

  • Date: Thu, May 27, 2025 – Thu, May 29, 2025
  • Venue: Singapore EXPO
  • Booth: Hall 3, Booth 3F3-13 (Taiwan Pavilion)

 

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