VTC 7251-GCIoT

Google Cloud AI Edge Vehicle Solution with Intel® Core™ 8th Gen. CPU
  • Main Feature
  • Built-in Google Edge TPU ML mini-PICe accelerator coprocessor
  • Intel® Core™ 8th Gen. desktop, i7-8700T, up to 4 GHz, 6 Core
  • 4 x Independent 10/100/1000 Mbps PoE 802.3af/at, total 60W
  • 1 x VGA and 1 x HDMI video output
  • 2 x External SSD and 2 x mSATA (BIOS selection) for RAID 0, 1
  • 3 x WWAN module slot, each for 2 x external SIM socket
  • 4 x mini-PCIe slot and 1 x M.2 B key slot
  • CE/FCC/E mark
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CPU Intel® Core™ 8th Gen. i7-8700T, up to 4 GHz, 35W, 6 Core Compatible Intel® Core™ 9th Gen. (Coffee Lake Refresh)
Chipset Intel® Q370 platform controller hub
Google Edge TPU (Coral ML accelerator card) Hardware interface: mini-PCIe (half size) Serial interface: PCIe Gen2 x1 Performance: 4TOPS @2Watt Operating voltage: 3.3V +/- 10 % Dimensions: 30mm x 26.8mm x 2.5 mm
Memory 2-Channel 204-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels, non-ECC up to 2666 MHz), default 4GB + 4GB industrial grade memory
Video Output Chipset Intel® UHD Graphics 630 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz
Storage 2 x 2.5” SATA 3.0 external SSD (compatible with 15mm height), RAID 0/1 supported 2 x mSTAT 3.0 (BIOS selection)
Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0 & SATA 3.0 (BIOS selection)) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0 & SATA 3.0 (BIOS selection)) 1 x Full size mini-PCIe socket (USB 2.0), optional M.2 key B (USB 2.0, USB 3.0) 1 x Full size mini-PCIe socket (USB 2.0), optional M.2 key B (USB 2.0, USB 3.0) 1 x M.2 key B (USB 2.0, USB 3.0)
GNSS and On Board Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou Optional modules with dead reckoning available TPM 2.0 by Infineon SLB9665TT2 (BOM option) G Sensor (3-axis, 10-bit resolution)
Power over Ethernet 4 x Independent LAN, 10/100/1000 Mbps I210-IT GbE, PoE 802.3af/at, max. 60W 1 x LAN, 10/100/1000 Mbps I219 support iAMT and WOL
I/O Interface-Front 20 x LED indicators (including 4 x programmable LED) 4 x USB 3.1 type A (5V/1A) 6 x Externally accessible SIM card sockets (4 x WWAN + 8 x SIM, BOM option) 1 x Reset button 1 x Power button with LED 2 x 2.5” external SSD 11 x SMA antenna hole (GPS/WWAN/WLAN)
I/O Interface-Rear 4 x RJ45 PoE 802.3af/at, max. 60W 1 x RJ45 LAN port, 10/100/1000 Mbps 1 x 3-pin terminal block for 9V~36VDC 1 x Connector (4 x 2) for 12VDC/2A output, power button, 2 x MDI 1 x Mic-in, 2 x Line-out 2 x DB9 for full RS232 1 x DB9 for full RS232/422/485 (RI, 5V/0.5A, 12V/0.5A) 1 x DB15
- 1 x Isolated CANBus 2.0B
- 1 x GPS DR (option)
- 4 x DI and 4 x DO
2 x USB 3.1 type A (5V/1A) 1 x HDMI 1.4b 1 x VGA
Power Management & Software Support Power input 9~36VDC Cranking voltage: 6V~9V (< 30 seconds) Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code
Operating System Linux
Dimensions 260 x 256 x 83.5 (W x D x H) (mm)
Weight 4.2kg
Environment Operating temperatures
- -30°C~60°C (w/ industrial SSD) with air flow
Storage temperatures: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (random)
- 2g@5~500 Hz (in operation, SSD)
Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
Shock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications CE approval FCC Class A E13 mark
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