NEXCOM Brings Expanded Edge, Security, and Quantum-Resistant Innovations to MWC Barcelona 2026

NEXCOM, a leading supplier of network appliances, will join MWC Barcelona 2026 presenting a broadened portfolio designed to support future-ready networks across telecom, enterprise, and industrial environments. As one of the selected innovators featured in the Taiwan Pavilion—supported by the Industrial Development Bureau, MOEA—NEXCOM brings breakthrough technologies designed and manufactured in Taiwan to MWC Barcelona at booth 5A61 (Hall 5).

Visitors will be able to explore NEXCOM’s latest innovations designed to address emerging challenges in secure, synchronized, and resilient networking. Key highlights include:

• Post-Quantum Cryptography (PQC)

  Platforms designed to integrate PQC-ready frameworks that aim to help customers strengthen long-term protection as operators prepare for quantum-era threats.

• Time-Sensitive Networking (TSN) Activation Kit

  Total solution to simplify configuration, accelerate deployment, and enable precise, real-time synchronization across smart warehouse automation, production logistics, and industrial edge networks.

• NEXBOOT^® Dual-Layer Failover Mechanism

  A combined hardware-level redundancy and firmware-level self-recovery approach to reduce costly field returns and maintenance time — with minimal effort.

• Compact, Value-Driven Network Appliances

  SD-Edge, security, and uCPE platforms engineered for strong performance, efficient power usage, and rich functionality within smaller footprints.

• Collaborative Partner Solutions

  Ecosystem-integrated solutions demonstrating how NEXCOM hardware aligns with partner technologies to accelerate the rollout of advanced networking, cybersecurity, and edge-AI applications.

NEXCOM invites industry professionals to secure a meeting slot and explore collaboration possibilities. NEXCOM experts will be available throughout the event at the Taiwan Pavilion booth 5A61 (Hall 5) to guide through latest network and communication platforms and engage in focused solution discussions.

Event Details

• Date: Mon, March 2, 2026 – Thu, March 5, 2026
• Venue: Fira Gran Via
• Booth: Hall 5, Booth 5A61 (Taiwan Pavilion)