| CPU | Intel® Core™ 8th Gen. i7-8700T, up to 4 GHz, 35W, 6 Core - Compatible Intel® Core™ 9th Gen. (Coffee Lake Refresh) | 
| Chipset | Intel® Q370 platform controller hub | 
| Memory | 2-Channel 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels, non-ECC up to 2666 MHz), default 4GB + 4GB industrial grade memory | 
| Video Output | Chipset Intel® UHD Graphics 630 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz | 
| Storage | 2 x 2.5”SATA 3.0 external SSD (compatible with 15mm height), RAID 0/1 supported 2 x mSTAT 3.0 (BIOS selection) | 
| Expansion | 1 x M.2 3042/3050/3052 (default) Key B socket (USB 2.0, USB 3.1) for LTE/5G NR module with dual SIM
                
                
                    1 x Full-size mini-PCIe socket (USB 2.0) for LTE with dual SIM Optional M.2 3042 Key B (USB 2.0, USB 3.1) for LTE/5G NR module 1 x Full-size mini-PCIe socket (USB 2.0) for LTE with dual SIM Optional M.2 3042 Key B (USB 2.0, USB 3.1) for LTE/5G NR module 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0 & SATA 3.0 [BIOS selection]) 1 x Full-size mini-PCIe socket (USB 2.0, PCIe 3.0 & SATA 3.0 [BIOS selection]) | 
| GNSS and On Board Sensor | 1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/Galileo/Beidou Optional modules with dead reckoning available TPM 2.0 by Infineon SLB9665TT2 G Sensor (3-axis, 10-bit resolution) | 
| Ethernet | 2 x Independent LAN, 10/100/1000 Mbps. LAN1 supports iAMT and WOL | 
| I/O Interface-Front | 13 x LED indicators (including 4 x programmable LED) 4 x USB 3.1 type A (5V/1A) 6 x Externally accessible SIM card sockets (4 x WWAN + 8 x SIM, BOM option) 1 x Reset button 1 x Power button with LED 2 x 2.5” external SSD 11 x SMA antenna hole (GPS/WWAN/WLAN) | 
| I/O Interface-Rear | 2 x RJ45 LAN port, 10/100/1000 Mbps
                
                
                    1 x 3-pin terminal block for 9V~36VDC
                
                
                    1 x Connector (4 x 2) for 12VDC/2A output, power button, 2 x MDI
                
                
                    1 x Mic-in, 2 x Line-out
                
                
                    2 x DB9 for full RS232 
                
                
                    1 x DB9 for full RS232/422/485 (RI, 5V/0.5A, 12V/0.5A)
                
                
                    1 x DB15 - 1 x Isolated CANBus 2.0B - 1 x GPS DR (option) - 4 x DI and 4 x DO 2 x USB 3.1 type A (5V/1A) 1 x HDMI 1.4b 1 x VGA | 
| Power Management & Software Support | Power input 9~36VDC Cranking voltage: 6V~9V (< 30 seconds) Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code | 
| Operating System | Windows 10 Linux | 
| Dimensions | 260 x 256 x 83.5 (W x D x H) (mm) | 
| Weight | 4.2kg | 
| Environment | Operating temperatures - -30°C~70°C (w/ industrial SSD) with air flow Storage temperatures: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (in operation, SSD) Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g | 
| Certifications | CE approval FCC Class A E-Mark (E13) |