TCA 6710 (ODM Only)

1U Rackmount w/ Marvell® OCTEON 10 COM-HPC Module, 8 x 1GbE and 4 x 2.5GbE Copper, 2 x 10GbE Copper/Fiber Combo, 2 x 25GbE Fiber Ports
  • Main Feature
  • Marvell® OCTEON 10 CN10308 8-core ARMv9 N2 2.5GHz
  • 95 x 120mm size A
  • 1 x DDR5-4800 ECC SO-DIMM slot, up to 32GB
  • 1 x 32GB eMMC
  • 2 x 512MB SPI Flash
  • 2 x 25GbE SFP28 ports
  • 2 x 10GbE RJ45/SFP+ combo ports
  • 4 x 2.5GbE RJ45 ports
  • 8 x 1GbE RJ45 ports
  • 1 x PCIe Gen5 x4 socket for SSD/FPGA/AI card
  • Supports 4G LTE/5G (optional)
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Datasheet(PDF)
Processor Marvell® OCTEON 10 CN10308, 8-core ARMv9 Neoverse N2, up to 2.5GHz
Main Memory 1 x DDR5 4800 SO-DIMM, ECC, up to 32GB
Storage Device 1 x 32GB TLC eMMC 2 x 512MB SPI Flash 1 x M.2 Key M 2232/2242/2260/2280/22110, support PCIe 5.0 x4
Interface-External-Front I/O 6 x LED: SYS, PWR, FAN, SSD, WiFi, LTE/5G 2 x Button: POWER, RESET 2 x 25GbE SFP28 port 2 x 10GbE RJ45/SFP+ combo port 4 x 2.5GbE RJ45 port 8 x 1GbE RJ45 port 2 x nano-SIM slot 1 x USB 3.2 Gen 1 host, Type-A 1 x USB console, Type-C
Interface-External-Rear I/O 2 x Power inlet 3 x Fixed smart fan 1 x Ground screw 2 x RP-SMA connector (2.4/5/6GHz) 4 x SMA connector for LTE/5G
Interface-Internal 1 x Mini PCIe (PCIe 3.0 x1) 1 x M.2 Key B 3042/3052 for LTE/5G module (USB signal) 1 x PCIe 5.0 x4 for M.2 SSD (via riser card and M.2 adapter)
or FPGA/GPU/AI card (FH3/4L) 1 x Socket for NEXCOM TPM 2.0 module
Power 550W 1+1 CRPS redundant power supply
Dimensions and Weight Chassis dimension (mm): 430 x 299.8 x 44 Package dimension(mm): 539 x 500 x 194 Without packing: TBC With packing: TBC
Environment Operating temperature: 0°C~40°C Storage temperature: -20°C~80°C Relative humidity: 10%~90% non-condensing
Certifications TBD
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