| Processor | Intel® Core™ 9/7/5/3 processor (Series 2), PBP up to 65W |
| Chipset | Intel® R680E |
| Memory | 2 x DDR5 SO-DIMM, supports ECC & dual-channel, up to 96GB |
| Dedicated GPU | Optional NVIDIA RTX™ 2000/3500 Ada MXM (fan kit required for NVIDIA RTX™ 3500) |
| Display Interface | 2 x HDMI® 1.4, up to 3840x2160@30Hz 1 x VGA, up to 1920x1200@60Hz (reserved) |
| Storage |
4 x 2.5” SATA SSD (9mm height, removable), supports RAID 0/1/5/10 (rROK 5520-WI) 8 x 2.5” SATA SSD (9mm height, removable), supports RAID 0/1/5/10 (rROK 5520-WIC7S) 1 x M.2 Key M 2240/2280 NVMe SSD (PCIe 4.0 x4) |
| Expansion Slot | 2 x Full-size Mini PCIe slot (USB 2.0, PCIe 3.0) 4 x M.2 Key B 3042/3050/3052 slot (USB 2.0, USB 3.2 Gen 2) for LTE/5G NR module with 2 x external dual nano-SIMs and 2 x internal dual nano-SIMs 1 x M.2 Key E 2230/3052 slot (USB 2.0, PCIe 3.0 x2) 1 x PCIe 4.0 x16 for MXM module |
| Sensor | 1 x Default u-blox NEO-M9N GNSS module for GPS+QZSS/ GLONASS/Galileo/Beidou 1 x 3D accelerometer and 3D gyroscope |
| System Capabilities | TPM 2.0: Infineon SLB 9672XU2.0 FW16.24 |
| I/O Interface Front |
8 x LED indicator (status/storage/WWAN/WLAN/programmable/GNSS)
1 x Power button
1 x Reset button
6 x USB 3.2 Gen 2, Type-A (5V/0.9A)
3 x COM port (DB9, COM1~3) for RS-232 (full)/422/485 (isolation)
1 x AUDIO port (DB9) for 1 x Line in, 1 x Line out, 1 x Mic in
1 x DIO/CAN FD port (DB15 female) - 2 x Isolated CAN FD, compatible with CAN 2.0A/2.0B - 4 x DI and 4 x DO (isolation), power in source for DIO isolation, DC 9V~36V 2 x HDMI® 1.4 1 x M23 connector for power input and ignition 1 x SMA connector for GNSS 4 x RP-SMA connector hole for WLAN 16 x SMA connector hole for WWAN 4 x Externally accessible dual nano-SIM with cover 1 x Expansion slot for an optional dual-port 10GbE SFP+ module or an optional 4-port M12 X-coded LAN module rROK 5520-WI - 1 x Removable SSD tray for 4 x 2.5” SSD - 1 x 2.5GbE M12 X-coded connector, Intel® I226, supports WoL - 1 x 2.5GbE M12 X-coded connector, Intel® I226 rROK 5520-WIC7S - 2 x Removable SSD tray for 8 x 2.5” SSD - 1 x 2.5GbE M12 X-coded connector, Intel® I226, supports WoL - 7 × 1GbE M12 X-coded PoE connector (1 × IEEE 802.3af/at/bt + 6 × IEEE 802.3af/at), switching, total up to 80W (non-isolated) |
| Power Management |
DC 24V~110V power input w/ isolation
Power budget: - rROK 5520-WI: 180W - rROK 5520-WIC7S: 360W Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software Support S3/S4 suspend mode Support 10~255 seconds WDT, setup by software SDK (Windows/Linux) including utility and sample code |
| Operating System | Windows 11 Linux 4.x |
| Mechanical |
Dimensions: 482.6mm (W) x 401.2mm (D) x 88.0mm (H)
Weight: - rROK 5520-WI: 13.1kg - rROK 5520-WIC7S: 14.9kg |
| Environment |
Operating temperature: - -40°C~70°C, 85°C for 10 minutes (w/ 35W/45W Core™ 9/7/5/3 processor, PoE (80W+60W) Storage temperature: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (SSD): - Operating: IEC 60068-2-64, Random 2g@5Hz~500Hz - Operating: MIL-STD-810H, Method 514.8C, Procedure 1, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810H, Method 514.8E, Procedure 1, Category 24, minimum integrity test Shock (SSD): - Operating: MIL-STD-810H, Method 516.8, Procedure I, functional shock=40g - Non-operating: MIL-STD-810H, Method 516.8, Procedure V, crash hazard shock test=75g |
| Certifications |
CE, UKCA, FCC Class A
EN 50155:2021 - Ambient temperature EN 50155, Class OT4 without MXM module - Interruptions of voltage supply class S1 - Supply change over Class C1 - EMC EN 50121-1:2017, EN 50121-3-2:2016+A1:2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2 by request) EN 45545-2:2020+A1:2023 |