CPU Support | 6th generation Intel® Core™ i7/i5/i3 processor (65W/ 35W) TDPs, Socket LGA1151 |
Main Memory | 2 x DIMM, support Dual channel DDR4 NON-ECC DIMM 1866/2133 MT/S (Maximum32GB) |
Platform Control Hub | Intel® H110 Express Chipset PCH Intel® Q170 Express Chipset PCH |
BIOS | AMI system BIOS 16MBit SPI depended on AMT function Dual BIOS for Four PCIex1 and One PCIex4 |
Display |
The Processor Graphics contains a refresh of the ninth generation graphics
Intel® HD Graphics 530
Support independent triple display.
VGA: Resolution up to 1920*1200 pixels @60MHz
DVI : Resolution up to 1920*1200 pixels @60MHz
HDMI: Resolution up to 4096*2304 pixels @60MHz
DP: Resolution up to 4096*2304 pixels @60MHz * Supporting 4K display required two DDR channels of same size |
Audio | High definition audio interface (Compatible with NEXCOM audio daughter board PN: 10E000HDA00X0 EBK-HAD) |
On-board LAN | 1 x Intel® WG1219LM GbE PHY (PEAK 888Q support Intel® AMT 11) 1 x Intel® I211 Gigabit Ethernet Controller RJ45 with LED connecter x 2 Support Boot from LAN (PXE) Support Wake on LAN |
I/O Interface |
1 x PCI Express x16 and 1 PCI Express x4 to backplane
4 x PCI to backplane
PEAk 888VL2-Q - 5 x SATA 3.0 port (2 x SATA 3.0 to BP through BIOS setting) - 1 x M.2 2280/ 22110 M Key (NVMe Gen 3 PCIex4) - Support RAID 0/1/5/10 - SIO: ITE8786 , COM 1,3,4 Support RS232 , COM2 support RS232/422/485 can be selected RI/5V/12V through jumper PS2 KB/MS *1 JST connector - Parallel Port: 26-pin box header x 1 - 6 Ports USB2.0 and 4 ports USB3.0 2 ports USB2.0, 2 ports USB3.0 1 port USB2.0 Type A (PEAK 888Q only) 4 ports USB 2.0 through backplane 2 ports USB 3.0 through I/O bracket - 2*10 pin header to support TPM module - 2 x Smart FAN connector (for CPU, system) - On-board buzzer - Watchdog time out can be programmable by software from 1 second to 255 seconds |
Power Requirements | Power source from backplane through golden finger and AUX +12V Support ATX/AT function by jumper setting BIOS default is (ATX MODE) |
Dimensions | 338.58mm x 126.39mm, 8 layers (single side) |
Environment |
Board level operating temperatures: -20°C to 60°C
Storage temperatures: -20°C to 85°C
Relative humidity: 0% to 90% (operating, non-condensing) 0% to 95% (non-operating, non-condensing) |
Certifications | CE/FCC Class A compliant |