Main Board (PEAK 888VL2-H) |
PICMG1.3 full-size, the PEAK 888VL2-H, Intel® H110 PCH chipset supports 6th generation Intel® Core™ processor with dual DDR4 DIMM socket up to 32GB |
Backplan (NBP 14570) | The NBP 14570 is a 13-slot backplane for 4U chassis with 1 x SHB slot, 7 x PCI slots, 4 x PCIe x1 and 1 x PCIe x16. It follows PICMG 1.3 platform specifications and supports ATX power supply |
I/O Interface-Front | 2 x 5.25” drive bay 1 x 2.5” drive bay 2x USB 2.0 (backplane P/H) 1 x HDD LED (red), 1 x power LED (green) 2 x Switch (power/reset switch) |
I/O Interface-Rear | 1 x VGA 2 x GbE LAN 2 x USB 3.0, 2 x USB 2.0 (I/O bracket) 2 x COM ports 1 x LPT port (I/O bracket) 1 x Combo PS/2 KB&MS (I/O bracket) |
Storage | 2 x 5.25” drive bay (up to 3 x 5.25” to 3.5” drive bay) 1 x 2.5” drive bay 2 x 3.5” drive bay |
I/O Interface-Internal (optional) | 1 x Pin header for TPM 1 x HDA header |
Power Supply | 500W ATX power supply Main connector: 20+4 pin Input voltage: 110V-240V/50Hz-60Hz Out put: +5VSB@2.5A, +3.3V@24A, +5V@20A, +12V1@18A, +12V2@18A, -12V@0.3A |
Physical Construction | Form factor: 4U 19" rackmount industrial computing chassis Construction: heavy-duty cold rolled electroplated steel Color: black/white Dimensions: 482 × 450 × 172 ± 2.0 (D x W x H) (mm) Mounting: 2 x rack mount ear Cooling system: 1 Weight: 17.4kg |
Environment | Operating temperature: 0°C~50°C Operating humidity: 10%~90% (non-condensing) Storage temperature: -10°C~60°C Non-operating humidity: 10%~ 90%@40°C non-condensing Reliability (design is compliant to following standard) |
Reliability (design is compliant to following standard EN55022 and EN61000) |
Certification CE approval FCC Class A |