ICES 675

COM Express Basic Type 6 8th Gen Intel® Core™/Xeon® Processors
  • Main Feature
  • 8th Gen Intel® Core™ processors, BGA 1440, PCH CM246
  • 2 channel DDR4 with ECC or non-ECC SO-DIMM 2666MHz up to 32GB
  • Support triple display VGA, 2 x DP, eDP/LVDS 24-bit dual channel
  • PCI express lane x16 (configurable: “1 x 16”;“2 x 8”;“1 x 8 + 2 x 4”)
  • PCI express lane x1 (Gen 3), 8 x (can be configured x 1, x 4)
  • IO: 2 x UART (RX/TX), 8-bit DIO, WDT, TPM (optional)
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CPU Support 8th Gen Intel® Core™ processors, BGA 1440 Intel® Xeon® E-2176M processor, 6 Cores, 12M Cache, 2.7GHz (4.4GHz), 45W (support ECC) Intel® Core™ i7-8850H processor, 6 Cores, 12M Cache, 2.6GHz (4.3GHz), 45W Intel® Core™ i5-8400H processor, 4 cores, 8M Cache, 2.5GHz (4.2GHz), 45W Intel® Mobile CM246
Main Memory Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32 GB 2666MHZ, ECC support as option with Intel® Xeon® E-2176M processor
Display Integrated Intel® Gen9 graphics engine 1 x VGA connector (resolution up to 1920 x 1080@60Hz) 1 x LVDS connector(resolution up to 1920 x 1080@60Hz) DDI 1/2 port configurable to HDMI 1.4/DVI/Display port 1.4 HDMI up to 4096 x 2160@30Hz/24bpp, DVI up to 1920 x 1200@60Hz, DP up to 4096 x 2304@60Hz
COM Express Connector AB: LVDS: (LVDS/eDP co-lay), VGA: (VGA/DDI port3 co-lay), 1 x GbE LAN, 6 x PCIe x1, HD audio, 4 x SATA 3.0, 8 x USB 2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8-bit CD: DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0
Power Requirement +12VDC, +5Vsb Support both AT and ATX power supply mode
Dimensions 125 mm x 95 mm
Environment Board level operation temperture: -0°C to 60°C Storage temperture: -20˚C to 85˚C Relative humidty: 10% to 95% (operating, non-condensing) 5% to 95% (non-operating, non-condensing)
Certifications Meet CE/FCC Class B Ordering Information
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