ICES 674

COM Express Basic Type 6, 6/7th Gen. Intel® Core™/Xeon® Processors
  • Main Feature
  • Onboard 6/7th Gen Intel® Core™ i7/i5/i3/Xeon® + PCH QM175/CM238 (optional)
  • 2 channel DDR4 with non-ECC/SO-DIMM 2133MHZ up to 32GB
  • Support display LVDS/VGA/DDI 1/DDI 2
  • PCIe x16/8 PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 4 x SATA 3.0 and GBE
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Datasheet(PDF)
CPU/Chipset Support Intel® Mobile QM175 Intel® i7-7820EQ Core™ i7, 4 x 3.0 GHz (3.7 GHz), GT2, 45/35 W Intel® i7-6820EQ Core™ i7, 4 x 2.8 GHz (3.5 GHz), 45 W Intel® i7-6822EQ Core™ i7, 4 x 2.0 GHz (2.8 GHz), 25 W Intel® i5-7440EQ Core™ i5, 4 x 2.9 GHz (3.6 GHz), GT2, 45/35 W Intel® i5-7442EQ Core™ i5, 4 x 2.1 GHz (2.9 GHz), GT2, 25 W Intel® i5-6440EQ Core™ i5, 4 x 2.7 GHz (3.4 GHz), 45 W Intel® i5-6442EQ Core™ i5, 4 x 1.9 GHz (2.7 GHz), 25 W
Main Memory Dual channel DDR4 SO-DIMM memory socket with non-ECC support, up to 32 GB 2133/2400MHZ
Display Integrated Intel® Gen 9 graphics graphic engine 1 x VGA connector (resolution up to 1920 x 1080 @ 60Hz) 1 x LVDS connector (resolution up to 1920 x1080 @ 60Hz) DDI 1/2 port configurable to HDMI 1.4/DVI/DisplayPort 1.2 HDMI up to 4096 x 2160 @ 30/24Hz, DVI up to 1920 x1200 @ 60Hz, DP up to 4096 x 2304 @ 60Hz)
BIOS Up to 1 x 8MB (128Mb) SPI flash ROMs AMI (UEFI)
COM Express Connector AB : LVDS, VGA (VGA/eDP co-lay), 1 x Gbe LAN, 6 x PCIe x1, HD Audio, 4 x SATA III, 8 x USB 2.0, LPC Bus, SM Bus/I2C, 2 x COM, GPIO 8-bit CD : eDP (VGA/eDP co-lay), DDI1, DDI2, 1 x PCIe x16, 2 x PCIe x1, 4 x USB 3.0
Power Requirement +12VDC, +5Vsb Support both AT and ATX power supply mode
Dimensions 125mm (W) x 95mm (L)
Environment Board level operation temperture : -15°C to 60°C Storage temperture : -20˚C to 85˚C Relative humidty:
- 10% to 95% (operating, non-condensing)
- 5% to 95% (non-operating, non-condensing)
Certifications Meet CE/FCC Class A
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