|
|
Embedded Computing Solutions
NEXCOM's embedded computer solutions make life mor...
Embedded Computing Solutions
|
|
|
2015 Corporate Video
The IoT creates unprecedented opportunities in the...
2015 Corporate Video
|
ICES 674
COM Express Basic Type 6, 6/7th Gen. Intel® Core™/Xeon® Processors- Main Feature
- Onboard 6/7th Gen Intel® Core™ i7/i5/i3/Xeon® + PCH QM175/CM238 (optional)
- 2 channel DDR4 with non-ECC/SO-DIMM 2133MHZ up to 32GB
- Support display LVDS/VGA/DDI 1/DDI 2
- PCIe x16/8 PCIe x1, 4 x USB 3.0, 8 x USB 2.0, 4 x SATA 3.0 and GBE
Barebone
ICES 674 (P/N: 10K00067400X0)
Onboard Intel® 7th i7-7820E processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8bit GPIO
ICE 674-6640EQ (P/N: 10K00067401X0)
Onboard Intel® 6th ICES 674-6440EQ processor, w/DDR4 SO-DIMM, support multiple display from VGA/LVDSD/DDI1/2, 4 x SATA III, 1 x GbE LAN, 2 x COM, 4 x USB 3.0, 8 x USB 2.0, HD audio, 8-bit GPIO
Optional Accessories
ICES 674 heat spreader thermal pad screw (P/N: 5050200148X00)
ICES 674 cpu cooler fan heat sink screw (P/N: 5050300920X00)
Notice
Heat spreader: The heat spreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution.
