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DTA 1160

Virtualization Networks and Software-Defined Appliance with Intel Atom® SOC C3000
  • Main Feature
  • Intel Atom® C3000 SoC 8~16 cores, BGA type
  • Quick assist: up to 20Gbps crypto
  • Virtualization: Intel® VT-x, Intel® VT-d, SR-IOV, VMDq
  • DDR4-2400 ECC or non-ECC UDIMM, max.64GB
  • Support 2 x 10GbE SFP+ ports and 6 x 1GbE LAN ports
  • Internal one 2.5” SSD bay, on-board eMMC 5.0
  • 2 x USB 3.0 connector
  • TPM 1.2/2.0 supported
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Datasheet(PDF)
Main Board DTB1160 Intel Atom® C3000 series, BGA type
Main Memory 4 x DDR4-2400 ECC or non-ECC DIMM socket; max.64GB
LAN Features 2 x 10GbE SFP+ port 4 x 1GbE RJ45 copper ports: from Intel® i350 -AM4 2 x 1GbE RJ45 copper ports: from Marvell PHY
Expansion 1 x PCIe x8 connector (straddle type) with full PCIe x4 signals, SGMII/KR x2, 1 SATA 3.0 and 1 USB 3.0 signals 1 x M.2 2230 slot for Wi-Fi module (E key)
I/O Interface-Front 2 x USB 3.0 ports (5V/1A) 1 x RJ45 type console port 2 x SFP+ ports 6 x Copper ports 1 x Power button; 1 x Reset button 1 x 4 green LED indicators: power status/HDD status/system status/user define
(all LEDs are programmable) DC jack with lock (12V/5A)
I/O Interface-Rear 3 x SMA connector holes for Wi-Fi antennas
Storage 1 x 2.5” SATA HDD/SSD bay (internal) 1 x SATA connector (for SATA DOM) 1 x M.2 2242 SSD socket (SATA & NVMe) ; M key
Power Input DC 12V/5A 60W power adaptor
Dimensions Chassis dimension: 220 x 241 x 44 (mm) Carton dimension: 421 x 291 x 160 (mm)
Weight Without packing: 1.9kg With packing: 3.2kg
Environment Operating temperatures: 0°C~40°C Storage temperature: -20°C~ 80°C Relative humidity: 10%~90% non-condensing
Certifications CE approval FCC Class B UL
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