NDiS B561/B561-PoE

Visual Edge Computer Powered by 12th Gen Intel® Core™ Processor
  • Main Feature
  • Support 12th Gen Intel® Core™ i7/i5/i3 socket type processor
  • Intel® PCH Q670E
  • Intel® integrated UHD graphic engine driven by Xe architecture
  • Support 3 independent 4K@60Hz display output
  • HDMI 2.1 resolution can be up to 8K@60Hz
  • 1 x HDMI 2.1, 2 x HDMI 2.0
  • 8 x USB 3.2
  • 1 x RS-232/422/485, 3 x RS232
  • NDiS B561: 1 x GbE LAN, 2 x 2.5G GbE LAN
  • NDiS B561-PoE: 1 x GbE LAN, 2 x PoE (follow IEEE802.3af std)
  • 3 x M.2 socket Key B/E/M
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Datasheet(PDF)
CPU Support 12 Gen Intel® Core™ i7/i5/i3 LGA socket type processor, up to 35W Intel® Core™ i7-12700TE, 12 Core, 1.4GHz, 25M Cache Intel® Core™ i5-12500TE, 6 Core, 1.9GHz, 18M Cache Intel® Core™ i3-12100TE, 4 Core, 2.1GHz, 12M Cache
Chipset Intel® PCH Q670E
Graphics Intel® UHD graphics 730 series Intel® UHD graphics 770 series for i5 and above
Memory 2 x 262-pin SO-DIMM sockets, support DDR5 4800 MHz non- ECC, un-buffered memory up to 64G (single socket max 32GB)
I/O Interface-Front 1 x Power button 1 x Power LED, 1 x HDD LED 1 x Reset switch 2 x USB 3.2 4 x DB9 for COM1~ COM4
- COM1: RS-232/422/485
- COM2~4: RS232 3 x Antenna hole
I/O Interface-Rear +12V~24V DC-in (PoE with 24V DC-in) 1 x HDMI 2.1 support 8K@60Hz 2 x HDMI 2.0 support 4K@60Hz 6 x USB 3.2 1 x Intel® I219-LM GbE LAN port 2 x Intel® I226V 2.5G Ethernet LAN port (PoE with follow IEEE802.3af, total up to 30W) 1 x Mic-in, 1 x Line-out 1 x SIM slot*
* NOTE: NDiS B561 Series is designed with 2 x SIM slots. Dual SIM functionality depends on whether the LTE module specification. For example, when using QUECTEL EM06-Emodule, only one SIM card functions either through back-panel slot or internal slot 3 x Antenna hole
I/O Interface-Internal 8CH GPIO support 4 x GPO and 4 x GPI Onboard TPM 2.0
Storage 1 x M.2 2280 Key M (PCIe x4) socket (Top side) 1 x M.2 2280 Key M (PCIe x4,SATA) socket (Back side)
Environment NDiS B561 operating temperature: -20°C to 60°C w/ 0.7m/s air flow NDiS B561-PoE operating temperature: 0°C to 40°C w/ 0.7m/s air flow Storage temperature: -20°C to 80°C Humidity: 10 to 95% (non-condensing)
Expansion 1 x M.2 2230 Key E (PCIe x2, USB), support optional Wi-Fi modules 1 x M.2 3042/3052 Key B (PCIe x1, USB 3.2), support optional 3G, 4G or 5G modules 1 x SIM slot*
* NOTE: NDiS B561 Series is designed with 2 x SIM slots. Dual SIM functionality depends on whether the LTE module specification. For example, when using QUECTEL EM06-Emodule, only one SIM card functions either through back-panel slot or internal slot
Power Supply NDiS B561: 1 x External AC/DC 12V/120W power adapter NDiS B561-PoE: 1 x External AC/DC 24V/180W power adapter Input: 100VAC to 240VAC
Package Information 1 pc/carton G.W: 4.6kgs Dimension: 420 x 275 x 127mm
Certification CE Approval (EN55032/55035) FCC Class A (Part 15B)
Dimensions 238mm (W) x 190mm (D) x 67.1mm (H) w/o bracket
Operating System Support Win11/Win10/Linux Kernel
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