aROK 5510

Intel® Core™ 8/9th Gen./Xeon® CPU with Rich Storage Powerful Platform for AI Application and Storage Server
  • Main Feature
  • Intel® Coffee Lake S/Refresh 8th/9th-Gen Core™/Xeon® LGA1151 socket-type CPU
  • 100W power consumption graphics card support
  • Eight SIM cards + four WWAN modules support
  • LTE/5G WWAN module support
  • 6 x External SSD for RAID 0, 1, 5, 10
  • PCle 3.0 x4 NVMe 1.3 high performance SSD support
  • EN 50155, class OT4 conformity
  • 3 x mini-PCIe + 3 x M.2 socket expansion
  • Smart fan design with temperature-based RPMs
  • Optional expansion module for 4 x PoE M12 or 2 x 10GbE SFP+
  • Rackmount platform
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Datasheet(PDF)
CPU Support 8th/9th generation Intel® Core™ i7/i5/i3 / Xeon® LGA1151 socket
- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W
- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W
- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W
- Intel® Xeon® E-2278GEL, TDP 35W
- Intel® Celeron® G4900T, TDP 35W
Chipset Intel® C246 platform controller hub
Memory 4 x 260-pin 2400MHz DDR4 SO-DMIM sockets up to 32GB/channel (128GB for four channels) ECC memory to support: i3-9100TE/i3-8100T, E-2278GEL, G4900T
Video Output Chipset Intel® UHD graphics 630 1 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz
Discrete Graphics Card (optional) NVIDIA® GEFORCE® GTX 1650 SUPER up to 100W, 1280 CUDA® cores, 4GB GDDR6
Storage 6 x 2.5” SATA external SSD (compatible with 9.5mm drive) 1 x mSATA 1 x M.2 2280/2242/2260 Key M socket for SATA 3.0 or PCle 3.0 x4 NVMe 1.3 1 x Removable SD 3.0
Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM 1 x Full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen1/PCIe 3.0 (BOM optional), PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM 3 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2) for LTE/5G NR module with 2 x external SIM
GNSS and Onboard Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/Beidou G Sensor (3-axis, 10-bit resolution)
LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE 2-Port LAN 10GbE SFP+ (optional) 4-Port LAN M12 X-coded, 10/100/1000 Mbps, PoE 802.3af/at, max. 60W (optional)
Security TPM 2.0: Infineon SLB9665TT2.0FW5.62
I/O Interface-Front 12 x LED indicators (including 2 x programmable LED) 1 x HDMI 1.4b 1 x VGA 1 x M12 A-coded connector for 2 x USB2.0 3 x USB 3.1 Gen 2 type A (5V/1A) 1 x USB 3.1 Gen 1 type A (5V/1A) 8 x Externally accessible SIM card sockets with cover 6 x 2.5” removable SSD tray (with locker) 1 x SD with cover 1 x Reset button 1 x Power button 20 x SMA antenna 2 x LAN M12 X-coded, Intel® I210/I219 (support iAMT) 10/100/1000 Mbps 1 x DB9 (AUDIO) for1 x Mic-in, 2 x Line-out 2 x DB9 (COM1/COM2) for full RS232 (isolation) 2 x DB9 (COM3/COM4) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO)
- 1 x Isolated CANBus 2.0B
- 4 x DI and 4 x DO (isolation)
- Power in for DIO isolation, 9~48VDC 1 x Waterproof DC input connector with ignition
- 24VDC input with 2.5KVDC isolation
- 110VDC input with 2.5KVDC isolation
I/O Interface-Rear 4 x Smart fan (swappable) for system cooling
Power Management Power input 24VDC/110VDC w/ isolation Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software Support S3/S4 suspend mode 0~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code
Operating System Windows 10/Linux
Dimensions 483 x 400 x 95 (W x D x H) (mm)
*Please reserve total 3U height for aROK 5510 in rack
Weight 8.5kg
Environment Operating temperatures: EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, 100W TDP GPU, industrial SSD) with air flow Storage temperatures: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (random)
- 2g@5~500 Hz (in operation, SSD) Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications CE FCC Class A EN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request) EN 45545-2: 2013+A1:2015 (PCB)
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