ICES 671

COM Express Type 6, COMPACT Size Module with 4th Gen. Intel® Core™ i7/i5/i3 processors MCP solution, DDR3L/GbE/4SATA/4 x PCIex1/DP/2 x USB3.0
  • Main Feature
  • 4th gen. Intel® Core™ i7/i5/i3 processor ( co-layout with boardwell MCP)
  • Triple independent display integrated GT1/GT2/GT3 to support: VGA, dual 18-/24 LVDS, HDMI, DP, DVI
  • Dual DDR3L/SO-DIMm (1600Mhz) up to 16GB without ECC memory support
  • Up to 2 x USB3.0/8 X USB2.0/4 x SATA 3.0/4 x PCIex1/WDT/GPIO/I2C
  • Dimension 95 x 95mm (W x L)
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Datasheet(PDF)
CPU Support 4th generation Intel® Core™ i7/i5/i3 processor MCP
Main Memory Dual DDR3L/SO-DIMMs, without ECC support 1600MHz memory up to 16GB
BIOS AMI UEFI BIOS Plug and play support Advanced Power Management and Advanced Configuration & Power Interface support
Display Intel® HD Graphic /GT1/GT2/GT3 with DX 11.1 , OGL 3.2, OCL 1.2 support Single and dual channel 18/24 LVDS VGA interface (1920 x 1200) DDI 1 with HDMI/DP/DVI support ( DDI2: optional)
Audio HD audio interface
On-board LAN Intel® I218LM GbE controller, support boot from LAN, wake on LAN Support PXE boot from LAN, wake on LAN function Signals down to I/O board
COM Express Connector AB:
VGA/LVDS/HDA/4 X SATA/GbE/4 x PCIex1/8 X USB2.0
LPC bus/GPIO/SMBus (I2C)/SPI BIOS
CD:
2 x USB3.0/2 x DDI (DDI2 Optional)
Power Requirements +12V, +5VSB, +3.3V RTC power Support both AT and ATX power supply mode One 3 pins 90 degree edge-connector for DC +12V fan
Dimensions 95mm (W) x 95mm (L)
Environment Board level operating temperatures: -15°C to 60°C Storage temperatures: -20°C to 80°C Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications Meet CE/FCC Class B
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