LCD Panel | 10.4-inch TFT LCD panel with LED backlight 1024x768 pixels Brightness: 1200cd/m² (typical) Viewing angle: 170° (H)/170° (V) Contrast ratio: 900:1 (typical) |
Touch Screen | Projected capacitive Anti-glare coating surface Transmission rate: 85% ± 3% |
CPU | Intel Atom® x6414RE processor, TDP 9W |
Memory | 1 x 260-pin DDR4 3200 SO-DIMM, up to 32GB Default 2666MHz 4GB with In-Band ECC (IBECC) |
Video Output | 1 x HDMI® 1.4b, up to 3840x2160@30Hz 1 x DP 1.4, up to 4096x2160@60Hz |
Storage | 1 x M.2 Key M 2280 socket (SATA 3.0 or PCle 3.0 x1) 1 x mSATA (occupied Mini PCIe slot) |
Expansion | 1 x M.2 Key E 2230 socket (USB 2.0, PCIe 3.0 x2) 1 x Full size Mini PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0) 1 x M.2 Key B 3042/3050/3052 socket (USB 2.0, USB 3.2 Gen 2) for LTE/5G NR module, BOM optional 1 x full size Mini PCIe socket (USB 2.0, USB 3.2 Gen 2 (BOM optional)) for LTE module, with 1 x external micro-SIM slot, 1 x internal micro-SIM slot |
GNSS and Onboard Sensor | 1 x Default u-blox NEO-M9N GNSS module for GPS + QZSS/Glonass/Galileo/Beidou 1 x 3D accelerometer and 3D gyroscope |
LAN and Power over Ethernet |
2 x LAN M12 X-coded, 10/100/1000/2500Mbps, Intel® I225-IT (optional PoE 802.3 af/at, max. 30W, w/ VIOD-POE2-01) |
Security | TPM 2.0: Infineon SLB 9670VQ2.0 FW7.62 |
I/O Interface-Lateral |
Right side - 1 x System reset button - 1 x USB 3.2 Gen 2 Type-A connector - 1 x micro-SIM slot w/ cover |
I/O Interface-Rear |
2 x DB9 (COM1/COM2) for full RS-232/422/485 (w/ isolation)
1 x Power connector, M12 A-coded 5-pin
2 x 10/100/1000/2500Mbps LAN, M12 X-coded 8-pin
1 x M12 A-coded 8-pin for 2 x USB 2.0
1 x Line in (stereo), 2 x Line out (setreo) (AUDIO, DB9, female)
1 x HDMI® output
1 x DP output
1 x M12 (MULTI PORT, A-coded 17-pin) - 4 x DI (w/ isolation) - 2 x DO (w/ isolation) - DC 14V~48V power input for DIO isolation - 1 x Isolated CAN bus 2.0B - 1 x Power button - 4 x Composite video input 1 x RP-SMA connector hole for Bluetooth 3 x RP-SMA connector hole for WLAN 2 x SMA connector hole for WWAN 1 x SMA connector for GNSS 1 x Ground connector |
Mechanical | Cooling system: fanless Enclosure: metal Ingress protection: front panel IP65 Mounting: panel mount, VESA 75 mount Dimensions: 336.0mm (W) x 257.6mm (D) x 73.7mm (H) Cutout dimension: 285.6mm x 207.2mm Weight: 3.9kg |
Power Management | DC 24V/36V (14V~48V) input, w/o isolation DC 24V/110V input, w/ isolation (BOM optional) Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT supported, setup by software SDK (Windows/Linux) including utility and sample code |
Environment |
Operating temperature - EN 50155, class OT3 (-30°C~70°C), 85°C for 10 minutes (w/ 9W TDP CPU, industrial SSD) with air flow - EN 50155, class OT1 (-30°C~60°C), w/ 9W TDP CPU, industrial SSD, PoE, with air flow Storage temperature: -40°C~80°C Relative humidity: 10%~90% (non-condensing) Vibration (random): 2g@5Hz~500Hz (in operation, SSD) Vibration - Operating: MIL-STD-810H, 514.8C Procedure 1, Category 4 - Storage: MIL-STD-810H, 514.8E Procedure 1, Category 24 Shock - Operating: MIL-STD-810H, Method 516.6, Procedure I, trucks and semi-trailers = 40g - Crash hazard: MIL-STD-810H, Method 516.6, Procedure V, ground equipment = 75g |
Operating System | Windows 10 Windows 11 Linux |
Standards/Certifications |
CE
FCC Class A
EN 50155:2017 - Ambient temperature EN 50155, Class OT3 (-30°C~70°C) - Interruptions of voltage supply class S1 - Supply change over class C1 - EMC EN 50121-1:2017, EN 50121-3-2:2016+A1:2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, by request) EN 45545-2:2020 (PCB) |