NEXCOM is pleased to announce the launch of the ICES 253- a COM Express Module which is equipped with Intel® Atom™ D525 Dual Core processor for improved system performance in a smaller package size. This computer on module is specifically designed to shorten system development time and offer an increased number of expansion options. ICES 253 will be deployed with customized carrier boards with NEXCOM's professional COM competence center (CCC) service.
Developing a COM module is always a time-consuming process because it is often difficult to design and build the right solution to fit the application. NEXCOM provides an outstanding service to customers looking for computer-on-modules designs and customized carrier boards for embedded projects. With NEXCOM's CCC service, customers benefit from quick design-in COM Express form factors and scalable I/O customizations to greatly reduce system development time and risk.
NEXCOM ICES 253 is a Type 2 Micro COM Express Module (95 mm x 95 mm) that pairs an Intel® ICH8M chipset with Intel® Atom™ D525 processor and one DDR2 SO-DIMM memory socket up to 2GB. With ICES 253, customers can simply integrate it with any carrier board to upgrade system performance. This effectively shortens development timelines.
In addition, ICES 253 offers developers a multitude of expansion options in line with mainstream market demand. ICES 253 featuring Intel® Atom™ D525 processor, provides the computing power whilst customized functionalities rely on application-specific carrier boards. Developers can always utilize ICES 253 with scalable I/O design on customized carrier board to develop unique applications and add value.
With the capabilities of quick time-to-market and flexible expansion ability, NEXCOM ICES 253 enhances advanced solutions for Panel PC, medical application and real-time data analyzer.