ICES 667

COM Express™ Type 6, Basic Module With QM77 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
  • Main Feature
  • 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
  • Intel® QM77 PCH (HM76 ) chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
  • Support two DDR3 SO-DIMMs 1333/ 1600 non-ECC up to 16GB
  • Support PCIex16 (Gen3.0) 7x PCIEx1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
  • Up to 3x DDI (DP/ HDMI/ DVI) multiple displays, VGA, dual channels 18/ 24-bit LVDS
  • Dimension: 95mm (W) x 125mm (L)
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ICES 667 (P/N: 10K00066700X0)
COM Express type 6, basic Module QM77 support 3rd Generation Intel® Core™ rPGA988 embedded processors, non-ECC DDR3/ 2x SO-DIMMs


ICES 667F-kit (P/N: 10K00066702X0)
COM Active fan kits with heat-spreader, heat-sink and cooling fan for ICES667


ICEB 8060 (P/N: 10KB086000X0)
COM Express type 6, COM.0 Rev. 2.0 Evaluation Carrier Board, 3DDI/ VGA/ LVDS/ 4USB3.0/ 8USB2.0/ 6COM/ 2GbE/ 5.1HD, SPDIF/ 2SATA3.0/ mSATA/ CFast/ PCIex16/ PCIEx4/ 2PCIex1/ mPCIe, ATX power input


ICEK 8060-T6 (P/N: MISC by Project Registered)
COM Express Type 6 Starter Kit ready for NEXOM COM Express Type 6 Basic modules assembly SO-DIMM system memory with passive/ active fan-sink onto Type 6 carrier ICEB8060 with bootable mini-SATA/ CFast-SSD, pre-load Win 7 trial version OS with 10.4" LCD/ LVDS display and build-in Flex-ATX PSU AC 110/220V Input

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