CPU |
Intel® Core™ Ultra Meteor-Lake H - Core™ Ultra 9 processor 185H - CoreTM Ultra 5 processor 125H NPU - 2 x 2048 MACs computing performance Graphics - Intel® Arc™ graphics - Max resolution: 4096x2160@60Hz (HDMI®) - DirectX: 12.2, OpenGL: 4.6 |
Memory | 2 x DDR5 5600 SO-DIMM, 8GB defualt, up to 32G per DIMM |
Storage | 2 x 2.5” SATA 3.0 SSD (15mm height, removable) 1 x M.2 2280 Key M SSD (PCIe 4.0 x4), Hailo card in option |
Expansion Slots |
1 x Mini PCIe slot (PCIe 4.0, USB 2.0)
1 x Mini PCIe slot (PCIe 4.0, USB 2.0), BOM option for M.2 Key B (USB 3.2/2.0) , supports nano-SIMs 1 x M.2 Key B 3042/3052 (USB 3.2/2.0), supports nano-SIMs for LTE/5G module 1 x M.2 Key E 2230 (PCIe 4.0 x2 & USB 2.0) |
Display | 1 x HDMI® 2.0a, up to 3840x2160@60Hz 1 x VGA, up to 1920x1200@60Hz |
Security |
TPM 2.0 - Infineon SLB9672VU2.0FW15.23 |
2.5GbE PoE++ |
5 x independent 2.5GbE RJ45 PoE port - iAMT/ WoL/ PXE support (LAN1) - 9Kbyte Jumbo frame - IEEE 802.3af/at/bt, total 80W, PSE 60W for LAN1 - PTP (IEEE 1588) support - Controller: Intel® I226-IT |
Audio | 1 x Line out, unbalanced stereo, left/right channel, audio Jack 1 x MIC in, stereo, audio Jack 1 x Line in, wafer reserved Codec: Realtek ALC888S-VD2-GR |
DC Out | 12V DC/3A, terminal block |
USB |
1 x USB 3.2 Gen 2 - Host Type-A - 5V@900mA - Up to 10Gbit/s link speed & compliance with USB 2.0 (LS/FS/HS link speed) 3 x USB 2.0 - Host Type-A - 5V@500mA each |
Serial Port | 2 x COM port (DB9), supports full RS-232/422/485 1 x COM port (DB9), supports full RS-232 (DB9) 1 x full RS-232 (wafer reserved) RS-232 working voltage, +- 9V, baud rate up to 115.2kb/s 2-wire/4-wire RS-485 (Baud rate: 300~115.2Kbps) |
MEMS Sensor | 3D accelerometer and 3D gyroscope, ST LSM6DSLTR |
DI/DO (isolation) |
4-bit input - Source: 9~36V DC (12V@0.6mA/24V@1.2mA) - External: 0~33V DC pull-high, high/low level 3.3 – 33/ 0 - 2V DC 4-bit output - Source: 9~36V DC (nominal 35mA@24V) - External: 5~36V DC pull-high, sink current w/ 220mA for each bit, 500mA max (@25C) Source or external can be selected by DIP S/W (default: source type) |
CAN Bus | 2 x CAN FD, compatible with CAN 2.0A/2.0B Up to 5Mb/s in data transmit, 2.5KV isolated IEC 61000-4-2 Electrostatic Discharge (ESD): ± 6KV/8KV (contact/air) |
GNSS |
u-blox NEO-M9N GNSS module (VIOB-GPS-07) for GPS/Gloness/QZSS/Galileo/Beidou Optional DR (Dead Reckoning) function, NEO-M9V (VIOB-GPSDR07) |
Power Supply | Nominal voltage: DC 9V to 36V Cranking voltage: DC 6V to 9V (less than 20 sec) Reverse protection, OCP & UVP (shut down once exceeding 36.5V) Ignition on/off control & programmable on/off delay timer Optional for remote power on/off control |
I/O ports, Front-Plate | ATX power & Reset button 8 x LED Indicator 4 x nano-SIM slot (SIM1-1, SIM1-2, SIM2-1, SIM2-2) 1 x USB 3.2, Type-A 3 x USB 2.0, Type-A 1 x HDMI®, 1 x VGA 2 x removable 2.5” SSD bay 1 x PR-SMA for GNSS |
I/O ports, Rear-Plate | 1 x RS-232 (DB9, COM3) 2 x RS-232/422/485 (DB9, COM1, COM2) Audio jack for Line out, MIC in Multi-port DB15 (4 x DI, 4 x DO, 2 x CAN FD) 5 x 2.5GbE PoE, RJ45 1 x terminal block (DC-OUT) 3-pin Phoenix for 9~36V DC-in 2 x PR-SMA for Wi-Fi ant. 4 x SMA for LTE/5G ant. |
Internal Heater | Activation threshold: less than -10°C Remote heater ON/OFF signal, wafer reserved |
Dimensions & Weight | 260.0mm x 180.0mm x 66.5mm (w/o mount bracket) 280.0mm x 180.0mm x 72.5mm (w/ mount bracket) Weight: 5.8kg |
Environment | Operating temperatures: -40°C~60°C (45W CPU w/ PoE, fanless) Storage temperatures: -40°C~85°C Relative humidity: 10%~95% (non-condensing) |
Vibration & Shock |
Vibration in operating - MIL-STD-810H, 514.8C Procedure 6, Category 4 - IEC 60068-2-64: 2.0g@5~500Hz Vibration in storage - MIL-STD-810H, 514.8E Procedure 1, Category 24, 7.7g Shock - MIL-STD-810H, 516.8 Procedure I, trucks and semi-trailers=40g - Crash hazard: Procedure V, ground equipment=75g |
Certifications | CE approval, FCC Class A, UKCA, E mark certified |
Operating System | Windows 11 Windows 10 64-bit, Windows 10 IOT Enterprise 64-bit Linux (Ubuntu 22.04, Linux 5.19) |