NSA 6310 (Coming Soon)

1U Rackmount uCPE w/ NXP® Layerscape® LX2160A SoC Processors, 4 x GbE RJ45 and 2 x SerDes LAN Modules
  • Main Feature
  • NXP® Layerscape® LX2160A SoC, BGA type
  • 4 x DDR4-3100 ECC-DIMM
  • 1 x 2.5 SSD, 1 x M.2 2280
  • PCIe Gen3 x8 with SR-IOV
  • Dual boot device
  • Enhancing UEFI
  • Support secure boot and optional TPM
  • 2 x SerDes LAN modules support 25G/10G/1G
  • 4 x GbE RJ45
  • Optional IEEE1588 PTP
  • Optional BMC support with manager port
  • Redundant power supply
  • Optional PoE at/af support
  • Operating system: NXP® LSDK (Ubuntu userland)
Add to Inquiry
Datasheet(PDF)
Main Board NXP® Layerscape® LX2160A SoC, BGA type LX2160A, 16 cores LX2120A, 12 cores LX2080A, 8 cores
Main Memory 4 x DDR4 3100 ECC-DIMM sockets, up to 64GB
Storage 1 x 2.5” internal SSD/HDD bays 1 x M.2 2280 B key, supports SATA signal
Front I/O 4 x LED: Power/System/HDD/Error Button: Reset 1 x Console port: RJ45 x1 2 x Management port: RJ45 x2 (LX2160 and BMC) 2 x USB 3.0 type-A port 4 x GbE RJ45 ports 1 x Micro SIM card slot 2 x SerDes LAN module slots 1 x PCI-Express card slot 2 x Fixed smart fans 2 x Power inlets
Interface Internal 1 x mini-PCIe for Wi-Fi 1 x M.2 2280 B key with SIM slot for LTE 1 x SO-DIMM slot for NEXCOM BMC module SPI I/O pin-heard for GPS module SPI I/O pin-heard for TPM Micro SD slot for RMA
Power 550W 1+1 CRPS redundant power supply (default) 12V/550W + 54V/850W CRPS power supply (for PoE application)
Dimensions and Weight Chassis dimension (mm): 430 x 480 x 44 Package dimension(mm): TBD Without packing: TBD With packing: TBD
Environment Operating temperature: 0°C~40°C Storage temperature: -20°C~80°C Relative humidity: 10%~90%, non-condensing
Certifications CE/FCC Class A (planning) Arm Server Ready (planning)
Add to Inquiry
Take a minute and tell us what you think!