ICES 268

COM Express™ Type 2, Basic Module with QM77 Intel® 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
  • Main Feature
  • Intel® 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
  • Intel® QM77 PCH (HM76) chipset support PICMG COM.0 Rev. 2.0 Type 2, pin-outs
  • Support two DDR3 SO-DIMMs 1333/1600 non-ECC up to 16GB
  • Support PCIex16 (Gen3.0), 5x PCIex1, 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and 1x GbE
  • Support VGA, dual channels 18/24-bit LVDS and optional 1x DDI/ SDVO by PEG
  • Dimension: 95mm (mm) x 125mm (L)
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CPU Support Support Intel® 3rd generation Core™ i7/i5/i3 embedded rPGA988
– Intel® Core™ i7-3610QE (4x 2.3GHz/ 6MB cache/ Max. TDP 45W)
– Intel® Core™ i7-3610ME (2x 2.7GHz/ 3MB cache/ Max. TDP 35W)
– Intel® Celeron® B810 (2x 1.6GHz/ 2MB cache/ Max. TDP 35W)
Main Memory Two DDR3 SO-DIMMs, 1333/1600 MHz SDRAM non-ECC up to 16GB
Platform Control Hub Intel® QM77 PCH (option HM76) chipset
BIOS AMI UEFI System BIOS Plug and play support Advanced Power Management and ACPI support
Display Intel® HD graphics with DX11 support and supports Triple independent displays One PCI Express x16 Lane (Gen 3.0) down to the carried board Supports VGA, single/dual channels LVDS 18/24-bit interfaces Optional 1x DDI port B support HDMI, DVI, DisplayPort and SDVO by PEG with EBK-A2HDMI
Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 8.0 (supported by QM77 only) Support boot from LAN, wake on LAN function Signals down to I/O board
COM Express Connector AB
VGA/ LVDS/ 8x USB 2.0, HD Audio/ 2x SATA3.0, 2x SATA 2.0/ GbE/ GPIO/ LPC bus/ 5 x PCIex1/ SMBus (I2C)/ SPI BIOS / SPK out
PCIex16 (Gen. 3.0) / PCI (v2.3)/ IDE
Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W) x 125mm (L)
Environment Operating temperature: -15°C to 60°C Storage temperature: -20°C to 80°C Relative humidity: 10% to 90% (operating, non-condensing); 5% to 95% (non-operating, non-condensing)
Certifications Meet CE FCC Class A
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