EBC 357

Fanless Embedded Computer Intel Atom® Processor E39XX & J3455E Product Family
  • Main Feature
  • On-board Intel Atom® processor E39xx and J3455E processor family
  • CPU upside down design
  • CPU upside down design
  • 2 x 204-pin SO-DIMM DDR3L
  • Triplex display: HDMI/VGA/LVDS (or eDP)
  • 1 x M.2 (2242) B key
  • 2 x Intel® i210-IT PCI express Gigabit Ethernet
  • 4 x SATA 2.0
  • 2 x USB 3.0, 4 x USB 2.0, 4-in/4-out GPIO, Mic-in, Speak-out
  • Serial port: 3 x RS232, 1 x RS232/422/485 port
  • Support AT/ATX mode and single +12VDC input
Add to Inquiry
Datasheet(PDF)

EBC 357-E3950L (P/N: 10E00035703X0) RoHS Compliant
Low power embedded board with Intel Atom® processor E3950 and extended -20˚C~60˚C, with HDMI/VGA/LVDS,
2 x USB 3.0, 4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

 

EBC 357-E3950L (P/N: 10E00035704X0) RoHS Compliant
Low power embedded board with Intel Atom® processor E3950 and extended -20˚C~60˚C, with HDMI/VGA/LVDS,
2 x USB 3.0, 4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

 

EBC 357-E3930E (P/N: 10E00035705X0) RoHS Compliant
Low power embedded board with Intel Atom® processor E3950 and extended -20˚C~60˚C, with HDMI/VGA/eDP, 2 x USB 3.0, 4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

 

EBC 357-E3930E (P/N: 10E00035706X0) RoHS Compliant
Low power embedded board with Intel Atom® processor E3950 and extended -20˚C~60˚C, with HDMI/VGA/eDP, 2 x USB 3.0, 4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

 

EBC 357-J3455L (P/N: TBD) RoHS Compliant
Low power embedded board with Intel Atom® processor E3950 and extended 0˚C~60˚C, with HDMI/VGA/eDP, 2 x USB 3.0,
4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

 

EBC 357-J3455E (P/N: TBD) RoHS Compliant
Low power embedded board with Intel Atom® processor E3950 and extended 0˚C~60˚C, with HDMI/VGA/eDP, 2 x USB 3.0,
4 x USB 2.0, 2 x COMs, 1 x M.2 B key, 2 x Gigabit LAN, 1 x SATA

 

Notice
Heat spreader: The heatspreader acts as a thermal coupling device to the module and is thermally coupled to the CPU via a thermal gap filler. On some modules, it may also be thermally coupled to other heat generating components with the use of additional thermal gap fillers. Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered as a heatsink. It has been designed as a thermal interface between the module and the application specific thermal solution.

Add to Inquiry
Take a minute and tell us what you think!