ICES 671

COM Express Type 6, COMPACT Size Module with 4th Gen. Intel® Core™ i7/i5/i3 processors MCP solution, DDR3L/GbE/4SATA/4 x PCIex1/DP/2 x USB3.0
  • Main Feature
  • 4th gen. Intel® Core™ i7/i5/i3 processor ( co-layout with boardwell MCP)
  • Triple independent display integrated GT1/GT2/GT3 to support: VGA, dual 18-/24 LVDS, HDMI, DP, DVI
  • Dual DDR3L/SO-DIMm (1600Mhz) up to 16GB without ECC memory support
  • Up to 2 x USB3.0/8 X USB2.0/4 x SATA 3.0/4 x PCIex1/WDT/GPIO/I2C
  • Dimension 95 x 95mm (W x L)
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Datasheet(PDF)

The ICES 671 is a COM Express Type 6 compact size module that features 4th generation Intel® Core™ i7/i5/i3 or Celeron® FCBGA1168 processor and dual DDR3L SO-DIMM memory socket 1600Mhz without ECC support, up to 16 GB. ICES670 is COM Express Type 6 pin-outs, compact module (95 x 95mm) to follow COM.0 Rev. 2.0, This new ICES671 supports dual DDR3L (without ECC) SO-DIMM (1600MHz) up to 16 GB, and advanced I/O interfaces such as PCI Express gen 2.0, 4 x SATA3.0, and 2 x USB3.0. ICES671 is integrated with Intel GT1/GT2/GT3 Integration graphic for powerful graphic processing and three-display capability through display interfaces like HDMI/DVI/Display Port/CRT, and dual channels LVDS. The Compact size COMe express module of ICES671 applied latest Intel shark bay-U MCP solution with lower power TDP(15W) and highest graphic and computing performance, which is ideal for application with high graphic requirement and multiple display connectivity, such as medical, digital signage, automation and surveillance applications.

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