ICES 667

COM Express™ Type 6, Basic Module With QM77 3rd Generation Intel® Core™ rPGA988 Embedded Processors Family
  • Main Feature
  • 3rd generation Intel® Embedded Core™ rPGA988 embedded processors family
  • Intel® QM77 PCH (HM76 ) chipset support PICMG COM.0 Rev. 2.0 Type 6 pin-outs
  • Support two DDR3 SO-DIMMs 1333/ 1600 non-ECC up to 16GB
  • Support PCIex16 (Gen3.0) 7x PCIEx1, 4x USB3.0/ 8x USB2.0, 2x SATA3.0/ 2x SATA2.0 and GbE
  • Up to 3x DDI (DP/ HDMI/ DVI) multiple displays, VGA, dual channels 18/ 24-bit LVDS
  • Dimension: 95mm (W) x 125mm (L)
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Datasheet(PDF)

The ICES 667 is a Type 6 COM Express Basic Module featuring Intel® QM77 PCH (option HM76) chipset supports 3rd generation Intel® Core™ i7/ i5/ i3 rPGA988 embedded processors up to i7-3610QE (4x 2.3Ghz/ max.TDP 45W) with two DDR3 SO-DIMMs 1333/ 1600MHz non-ECC up to 16GB.

The 3rd Generation Intel® Core™ i7/ i5/ i3 processors integrated with Intel® HD graphics with DX11 support one PCIex16 (Gen 3.0) to carrier board. The Three DDI interfaces allows ICES 667 implement HDMI, DVI, Display Port, SDVO on Customer Solution Board besides VGA, LVDS interface. The high performance ICES 667 COM Express Module supports 4x SATA2.0/ 3.0, 12x USB 2.0/ 3.0 and 7x PCIe x 1 lanes through the carrier board; NEXCOM is offering standard Type 6 carrier board, ICEB 8060 to help device makers and equipment builders to evaluate full set of I/O function and add-on cards at early development stage.

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