ICES 267S

COM Express Type 2 Basic Module with QM67 Support 2nd Generation Core™ Mobile Processor Family
  • Main Feature
  • Intel® 2nd generation Intel® Core™ processor family
  • Intel® QM67 PCH chipset
  • 1x DDR3 SO-DIMM socket support non-ECC DDR3 800/1066/1333MHz up to 8GB
  • Support SDVO
  • Type 2 COM Express 2.0 module support 6 Express lanes, 32 bit PCI interface, one IDE and Gigabit LAN
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Datasheet(PDF)
CPU Support Support 2nd generation Intel® Core™ processor family, FCBGA 1023
Main Memory One DDR3 800/ 1066/ 1333MHz SO-DIMM, up to 8GB
Platform Control Hub Intel® QM67 (option HM65) PCH chipset
BIOS AMI System BIOS Plug and play support Advanced power management and advanced configuration & power interface support
Display Intel® HD graphics with DX11 support Drive a standard progressive scan analog monitor resolution up to 2048x1536@60Hz LFP LVDS interface to support 18/24-bit & single/dual channel interface
Audio HD audio interface
On-board LAN Intel® 82579LM Gigabit Ethernet, support iAMT 7.0(supported with QM67 only) Support boot from LAN, wake on LAN function Signals down to I/O board
COM Express Connector AB
VGA/ LVDS/ 8x USB 2.0/ HD Audio/ 3x SATA/ LAN/ GPIO/ LPC bus
One PCIe x4/ two PCIe x1/ SMBus (I2C)/ SPI BIOS
CD
IDE/ PCI/ SDVO
Power Requirements +12V, +5VSB, +3.3V RTC power
Dimensions 95mm (W)x 125mm (L)
Environment Board level operating temperatures: -15°C to 60°C Storage temperatures: -20°C to 80°C Relative humidity: 10% to 90% (operating, non-condensing) 5% to 95% (non-operating, non-condensing)
Certifications CE approval FCC Class A
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