|Industrial Computing Products Powered by Intel® Atom™ D525 Platform Powered by Intel® Atom™ D525 platform, NEXCOM's pr...|
NEXCOM ICEK8050C-T2 as proof-of-concept as pre- configured system of COM Express starter-kit join- design- win assistance package based on COM Express type 2, pin-out defined by PICMG, COM.0 Rev. 2.0 specification. NEXCOM configure and assembly to order service with COM Express Type 2, pin-outs Compact Modules (95x 95mm) ICES253 and ICES254 or Basic Module (125x 95mm) like ICES267 or ICES267S or ICES268 with active heat-sink for higher computing embedded processors up to i7-2715QE or i7-3610QE of Intel® 2nd. or 3rd. Generation Core™ i7/ i5/ i3 and Celeron B810E/ 827E/ 847E Mobile processors to adapt wide range of Industrial and embedded applications.
ICEK8050C-T2 features bootable CFast/ SSD from external access or mini-SATA/ SSD via mini-PCIe slot (half-/ full-size slot) from internal build-in onto ICEB8050C ICEK8050C-T2 also support legacy SATA and CF/ shared IDE-HDD bootable interfaces. ICEK8050C-T2 support added-on card slots of1x PCIex16, 1xPCIex4, 1x PCIex1 and 1x PCI (v2.3) slot for you may add-in I/O cards as evaluation during project development.